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Alphabet’s Google<\/a> has delayed the release of a fully custom chip for its Pixel<\/a> smartphones until 2025, The Information reported on Thursday, citing two people familiar with the matter.<\/p>\n Google originally planned to release the chip, internally called Redondo, next year to replace the semicustom chips it currently designs with Samsung Electronics, the report said.<\/p>\n The tech giant will also switch from Samsung to Taiwan Semiconductor Manufacturing <\/a>(TSMC) for making the chips, called Tensors, according to The Information.<\/p>\n The world’s largest contract chipmaker counts companies such as Apple<\/a> and Nvidia<\/a> among its customers.<\/p>\n Google did not immediately respond to a Reuters request for comment, while TSMC declined to comment.<\/p>\n Google will stick with Samsung for another year and wait until 2025 to introduce a fully custom design chip, internally code-named Laguna, according to The Information.<\/p>\n The Laguna chip will be based on TSMC’s 3-nanometer manufacturing process, currently the world’s most advanced chipmaking process, the report added.<\/p>\n Google’s in-house Tensor G2 SoC powers the new Pixel 7a<\/a> and Pixel Fold<\/a> smartphones that went official in May during the company’s I\/O event. The Tensor G2 SoC is also present in last year’s Pixel 7<\/a> and Pixel 7 Pro<\/a> models. The upcoming Pixel 8 series smartphones are expected to pack the next-generation chipset from Google, the Tensor G3 codenamed \u201cZuma\u201d. A recent leak suggested<\/a> that it will feature 9 Arm cores and 10 GPU cores with a 1+4+4 layout. It could include one 3.00GHz Cortex-X3 core, four 2.45GHz Cortex-A715 cores, and four 2.15GHz Cortex-A510 cores.<\/p>\n